ECOREL FREE 305-21
- SAC305 lead free solder paste
- No clean SMT printing process
- High reliability – Bono test compliant
ECOREL FREE 305-21
Especially designed for applications which needs high chemical reliability and where post reflow cleaning is not an option. This solder paste has excellent BONO test values, which is a key attribute to control the risk for electrochemical migration (ECM), especially when exposed to challenging conditions of high temperature and humidity.
ECOREL FREE 305-21 has also nice visual solder joint cosmetics with transparent residues, even after multiple reflow cycles. It shows no graping, even on very small deposits and has a high first pass yield testability in ICT.
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PERFORMANCE
- Chemically inert residue, minimizing the risk of corrosion mechanisms and leakage current
- Good compatibility with a large range of conformal coatings in the market
- Bono corrosion test compliant
COST
- Reduces the risk of pre-mature failures & product recall
- Possible to avoid flux cleaning after reflow (depending on customer specifications)
HSE
- Lead free
- Halogen free
- Free of CMR containing substances
PROCESS RECOMMENDATION
The best process will depend on factors such as operating conditions, equipment, board or component design. Check our product datasheet for info on process recommendations. Be assured, our team is ready to advise and assist you in the implementation of our products.